Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Paperback)

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore By Hengyun Zhang, Faxing Che Author, Tingyu Lin Cover Image

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Paperback)

Email or call for price & availability

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Product Details ISBN: 9780081025321
ISBN-10: 0081025327
Publisher: Woodhead Publishing
Publication Date: November 15th, 2019
Pages: 434
Language: English
Series: Woodhead Publishing Series in Electronic and Optical Materials