Embedded Dielectrics for Electronic Packaging (Hardcover)

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Embedded Dielectrics for Electronic Packaging By Ching-Ping Wong, Rong Sun, Shuhui Yu Cover Image

Embedded Dielectrics for Electronic Packaging (Hardcover)

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This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.
Product Details ISBN: 9789814619417
ISBN-10: 9814619418
Publisher: World Scientific Publishing Company
Publication Date: May 31st, 2025
Pages: 300
Language: English
Series: Wspc Series in Advanced Integration and Packaging